319942 datasheet(15/67 Pages) NUMONYX

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Numonyx® Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC)

Datasheet

3.2

64-Ball Easy BGA Package for 32-, 64-, 128-Mbit

Lead Count

—

Lead Tip Angle

0°

3°

5°

0°

3°

5°

Seating Plane Coplanarity

—

0.100

—

0.004

Lead to Package Offset

0.150

0.250

0.350

0.006

0.010

0.014

1. For legacy lead width, 0.15mm (Typ), 0.10mm (Min), 0.20mm (Max).

Table 1:

56-Lead TSOP Dimension Table

Parameter

Symbol

Millimeters

Inches

Min

Nom

Max

Min

Nom

Max

Figure 4: 64-Ball Easy BGA Mechanical Specifications

Ball A1

Corner

Seating

Plane

Top View - Plastic Backside

Complete Ink Mark Not Shown

Bottom View - Ball Side Up

Ball A1

Corner

Table 2:

Easy BGA Package Dimensions Table (Sheet 1 of 2)

Parameter

Symbol

Millimeters

Inches

Min

Nom

Max

Min

Nom

Max

Package Height

—

1.200

—

0.0472

Ball Height

0.250

—

0.0098

—

Package Body Thickness

—

0.780

—

0.0307

—

Ball (Lead) Width

0.310

0.410

0.510

0.012

0.016

0.020

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