2000 Feb 02

9

Philips Semiconductors

Product specification

UHF amplifier module

BGY925

List of components (See Figs 14 and 15)

Note

1. The striplines are on a double copper-clad printed-circuit board with epoxy dielectric (

ε

COMPONENT

DESCRIPTION

VALUE

CATALOGUE NO.

C1, C2

electrolytic capacitor

10

µF; 35 V

C3, C4

multilayer ceramic chip capacitor

100 nF; 50 V

L1, L2

Grade 4S2 Ferroxcube bead

4330 030 36300

R1, R2

metal film resistor

10

Ω; 0.4 W

2322 195 13109

stripline; note 1

50

Ω

MOUNTING RECOMMENDATIONS

To ensure a good thermal contact and to prevent

mechanical stress when bolted down, the flatness of the

mounting base is designed to be typically better than

0.1 mm. The mounting area of the heatsink should be flat

and free from burrs and loose particles. The heatsink

should be rigid and not prone to bowing under thermal

cycling conditions. The thickness of a solid heatsink

should be not less than 5 mm to ensure a rigid assembly.

A thin, even layer of thermal compound should be applied

between the mounting base and the heatsink to achieve

the best possible thermal contact resistance. Excessive

use of thermal compound will result in an increase in

thermal resistance and possible bowing of the

mounting-base; too little will also result in poor thermal

conduction.

The module should be mounted to the heatsink using

3 mm bolts with flat washers. The bolts should first be

tightened to “finger tight” and then further tightened in

alternating steps to a maximum torque of 0.4 to 0.6 Nm.

Once mounted on the heatsink, the module leads can be

soldered to the printed-circuit board. A soldering iron may

be used up to a temperature of 250

°C for a maximum of

10 seconds at a distance of 2 mm from the plastic cap.

ESD precautions must be taken to protect the device from

electrostatic damage.