Data Sheet G14451EJ2V0DS00

10

µµµµPC2250 SERIES

RECOMMENDED SOLDERING CONDITIONS

Solder this product under the following recommended conditions.

For details of the recommended soldering conditions, refer to information document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended, consult NEC.

Through Hole Type Soldering Conditions

µµµµPC2251H, 2253H, 2255H: 4-pin plastic SIP (TO-126)

Soldering Method

Soldering Conditions

Wave soldering (Pins only)

Solder bath temperature: 260

°C max., Time: 10 sec max.

Partial heating

Pin temperature: 300

°C max., Time: 3 sec max. (per pin)

Caution When soldering this product using wave soldering, exercise care that the solder does not come

in direct contact with the package.