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Item

Requirement

Test Condition

Solder ability

95% of immersed area

must show no voids, pin

holes

The termination should be 95% covered with

new continuous solder coating

Solder temperature: 255±5°C

Test time: 5±1 seconds, (Per EIA-364-71)

Resistance to soldering

heat

No melting, cracks or

functional damage allowed

Preheating temperature: 150 ~ 200°C,

60~120 seconds

Liquidus temperature (TL): 217°C, 60~150

seconds

Peak temperature: 260°C

Time within 5 °C of peak temperature (Tc):

255°C, 30seconds

Reflow Profile

Preheating temperature: 150 ~ 200°C, 60~120 seconds

Liquidus temperature (TL): 217°C, 60~150 seconds

Peak temperature: 260°C

Time within 5 °C of peak temperature (Tc): 255°C, 30seconds