MP6619

– 5.4V TO 28V, 5A, H-BRIDGE MOTOR DRIVER

MP6619 Rev. 1.0

www.MonolithicPower.com

3

1/21/2021

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PIN FUNCTIONS

Pin #

Name

Description

1

IFB

Current-sense signal feedback. Connect the IFB and LSS pins together.

2, 11

VIN

Input supply.

3

OUT2

Output terminal 2.

4

BST2

Bootstrap pin for the OUT2 high-side MOSFET (HS-FET) gate driver. Connect a

capacitor between the BST2 and OUT2 pins.

5

EN

IC enable.

6, 7, 8

LSS

Low-side source connection. For current sense, connect a current-sense resistor

between the LSS pin and power ground.

9

BST1

Bootstrap pin for the OUT1 HS-FET gate driver. Connect a capacitor between BST1 and

OUT1.

10

OUT1

Output terminal 1.

12, 18

NC

No connection. Float this pin or connect it to AGND.

13

nFAULT Fault indication output. nFAULT is active low for fault conditions.

14

VCC

5V LDO output for internal driver and logic.

15

IN1

Output 1 control input. IN1 is pulled down internally.

16

IN2

Output 2 control input. IN2 is pulled down internally.

17

ISET

Current trip voltage setting. Connect a resistor to GND from the ISET pin.

19

AGND

Ground for internal logic.

ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) .................................... 36V

VOUTx ..................................... -0.3V to VIN + 0.3V

VBST1...................................................VOUT1 + 6V

VBST2...................................................VOUT2 + 6V

LSS ..............................................-0.3V to +0.6V

All other pins ...................................-0.3V to +6V

Continuous power dissipation (TA = 25°C) (2)

QFN-19 (3mmx3mm) ................................. 2.5W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +150°C

ESD Ratings

Human body model (HBM) ........................ ±2kV

Charged device model (CDM) ............. ±1.25kV

Recommended Operating Conditions (3)

Supply voltage (VIN) .........................5.4V to 28V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (4)

θJA

θJC

QFN-19 (3mmx3mm)............. 50....... 12 ... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation can produce an excessive die temperature, which

can cause the regulator to go into thermal shutdown. Internal

thermal

shutdown

circuitry

protects

the

device

from

permanent damage.

3) The device is not guaranteed to function outside of its

operation conditions.

4) Measured on a JESD51-7, 4-layer PCB.