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ES9080 Datasheet(PDF) 130 Page - ESS Technology,Inc |
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ES9080 Datasheet(HTML) 130 Page - ESS Technology,Inc |
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130 / 146 page  CONFIDENTIAL ADVANCE INFORMATION 0.4.3 ES9080 Product Datasheet ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 WWW.ESSTECH.COM 130 At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the values specified in Table RPC-2. The use of a higher Tp does not change the classification temperature (Tc). Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks. The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. |
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