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AD9236 Datasheet(PDF) 33 Page - Analog Devices |
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AD9236 Datasheet(HTML) 33 Page - Analog Devices |
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33 / 36 page ![]() AD9236 Rev. B | Page 33 of 36 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-153-AE 28 15 14 1 8° 0° SEATING PLANE COPLANARITY 0.10 1.20 MAX 6.40 BSC 0.65 BSC PIN 1 0.30 0.19 0.20 0.09 4.50 4.40 4.30 0.75 0.60 0.45 9.80 9.70 9.60 0.15 0.05 Figure 57. 28-Lead Thin Shrink Small Outline Package [TSSOP] (RU-28) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2 0.30 0.23 0.18 0.20 REF 0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM 12° MAX 1.00 0.85 0.80 SEATING PLANE COPLANARITY 0.08 1 32 8 9 25 24 16 17 0.50 0.40 0.30 3.50 REF 0.50 BSC PIN 1 INDICATOR TOP VIEW 5.00 BSC SQ 4.75 BSC SQ 3.25 3.10 SQ 2.95 PIN 1 INDICATOR 0.60 MAX 0.60 MAX 0.25 MIN EXPOSED PAD (BOTTOM VIEW) Figure 58. 32-Lead Frame Chip Scale Package [LFCSP_VQ] 5 mm × 5 mm Body, Very Thin Quad (CP-32-2) Dimensions shown in millimeters |
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