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ADPA1116 Datasheet(PDF) 1 Page - Analog Devices

Part # ADPA1116
Description  0.3 GHz to 6 GHz, 39.5 dBm, GaN Power Amplifier
PDF  17 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADPA1116 Datasheet(HTML) 1 Page - Analog Devices

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Data Sheet
ADPA1116
0.3 GHz to 6 GHz, 39.5 dBm, GaN Power Amplifier
Rev. 0
DOCUMENT FEEDBACK
TECHNICAL SUPPORT
Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to
change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
FEATURES
►
Internally matched, 0.3 GHz to 6 GHz, 39.5 dBm, GaN power
amplifier
►
RF input and RF output AC-coupled
►
Integrated drain bias inductors
►
Output power: 39.5 dBm typical from 0.5 GHz to 5 GHz
(PIN = 16.0 dBm)
►
Power gain: 23.5 dB typical from 0.5 GHz to 5 GHz
(PIN = 16.0 dBm)
►
PAE: 40% typical from 0.5 GHz to 5 GHz (PIN = 16.0 dBm)
►
Small signal gain: 33.5 dB typical from 0.5 GHz to 5 GHz
►
Supply voltage: 28 V
►
Quiescent current: 300 mA
APPLICATIONS
►
Electronic warfare
►
Communications
►
Radar
FUNCTIONAL BLOCK DIAGRAM
Figure 1. Functional Block Diagram
GENERAL DESCRIPTION
The ADPA1116 is a 0.3 GHz to 6 GHz power amplifier with a
saturated output power (POUT) of 39.5 dBm, power added efficiency
(PAE) of 40%, and a power gain of 23.5 dB typical from 0.5 GHz
to 5 GHz at an input power (PIN) of 16.0 dBm. The RF input and
RF output are internally matched and AC-coupled. A drain bias
voltage of 28 V is applied to the VDD1 and VDD2 pins, which have
integrated bias inductors. The drain current is set by applying a
negative voltage to the VGG1 pin.
The ADPA1116 is fabricated on a gallium nitride (GaN) process,
is housed in a 32-lead lead frame chip scale package, premolded
cavity [LFCSP_CAV], and is specified for operation from −40°C to
+85°C


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