Specifications and information are subject to change without notice

WJ Communications, Inc

• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

Page 11 of 11 May 2007 ver 1

AP602

High Dynamic Range 4W 28V HBT Amplifier

AP602-F Mechanical Information

°C reflow temperature) and leaded

(maximum 245

°C reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.

Outline Drawing

Mounting Configuration / Land Pattern

Thermal Specifications

Parameter

Rating

Referenced from peak junction to the

center of the bottomside ground paddle

16.6

°C / W

192 ºC

For catastrophic failure

250 ºC

Product Marking

The component will be laser marked with an

“AP602-F” product label with an alphanumeric

lot code on the top surface of the package.

Tape and reel specifications for this part will be

located on the website in the “Application

Notes” section.

Functional Pin Layout

Pin

Function

1

PIN_VBIAS

2, 3, 7, 8, 12, 13

N/C

4, 5, 6

RF IN

9, 10, 11

RF Output / Vcc

14

PIN_VPD

Backside paddle

GND

MSL / ESD Rating

ESD Rating: Class 1B

Value:

Passes

500V to <1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes

1000V to <2000V

Test:

Charged Device Model (CDM)

Standard:

JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +260

°C convection reflow

Standard:

JEDEC Standard J-STD-020

MTTF vs. Junction Temperature

1.E+05

1.E+06

1.E+07

1.E+08

1.E+09

120

140

160

180

200

Junction Temperature (°C)