Analog Integrated Circuit Device Data

Freescale Semiconductor

23

33926

REVISION HISTORY

4.0

12/2006

• Corrected minor typographic errors on pages 2, 7, 9, 11, 15, and 16.

• Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from

Maximum Ratings on page 5.

• Added notes Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for

immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the

device. on page 5 and Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC

standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID

to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. on page 5

REVISION

DATE

DESCRIPTION