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XTPSM81033VCDR Datasheet(PDF) 4 Page - Texas Instruments

Part # XTPSM81033VCDR
Description  TPSM81033 5.5V, 5.5A, 2.4MHz, Synchronous Boost Power Module with MagPack™ Packaging Technology, Power Good Indicator and Output Discharge Function
PDF  17 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

XTPSM81033VCDR Datasheet(HTML) 4 Page - Texas Instruments

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5 Specifications
Note
Device Limitations (intended to be removed for final material):
1. Inductor current limit function is not optimized. TI don't recommend to use TPSM81033 at the
condition that the input current is higher than 5A. Final material is expected to improve the current
limit function.
2. TPSM81033 doesn't support to remove input voltage at heavy load. TI recommend to remove
input voltage at no load, or connect EN to GND first with load and then remove input voltage. Final
material is expected to support remove input voltage at heavy load.
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Voltage range at terminals(2)
VIN, EN, FB, SW, VOUT
–0.3
7
V
Operating junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2)
All voltage values are with respect to network ground terminal.
5.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±750
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±500 V may actually have higher performance.
5.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN
Input voltage range
1.8
5.5
V
VOUT
Output voltage setting range
2.2
5.5
V
CIN
Effective input capacitance range
1.0
4.7
µF
COUT
Effective output capacitance range
IOUT <= 1A
4
10
1000
µF
IOUT > 1A
10
20
1000
µF
TJ
Operating junction temperature
–40
125
°C
TPSM81033
SLVSHL0B – JUNE 2024 – REVISED JULY 2024
www.ti.com
4
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Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: TPSM81033



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