5.4 Thermal Information

THERMAL METRIC (1)

TPSM81033

TPSM81033

UNIT

VCD (QFN)- 9 PINS

VCD (QFN)- 9 PINS

Standard

EVM (2)

RθJA

Junction-to-ambient thermal resistance

74.8

39.7

°C/W

RθJC

Junction-to-case thermal resistance

36.6

NA

°C/W

RθJB

Junction-to-board thermal resistance

21.7

NA

°C/W

ΨJT

Junction-to-top characterization parameter

0.7

TBD

°C/W

ΨJB

Junction-to-board characterization parameter

21.1

19.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Measured on TPSM81033EVM, 4-layer, 2oz copper NA PCB.

5.5 Typical Characteristics

VIN = 3.6V, VOUT = 5V, TA = 25°C, unless otherwise noted

Output Current (A)

0.0001

0.001

0.01

0.05

0.2 0.5 1

2 3 45

5

70

75

80

85

90

95

100

VIN=2.0 V

VIN=3.3 V

VIN=3.6 V

VIN=4.2 V

VIN = 2.0V, 3.3V, 3.6V, 4.2V. Auto PFM

Figure 5-1. Efficiency vs Output Current VOUT = 5V

Output Current (A)

0.0001

0.001

0.01

0.05

0.2 0.5 1

2 3 45

5

0

20

40

60

80

100

VIN=2.0 V

VIN=3.3 V

VIN=3.6 V

VIN=4.2 V

VIN = 2.0V, 3.3V, 3.6V, 4.2V. Forced PWM

Figure 5-2. Efficiency vs Output Current VOUT = 5 V

VIN = 2.0V, 3.3V, 3.6V, 4.2V; VOUT = 5V

Figure 5-3. Load Regulation in Auto PFM

Output Current (A)

0.0001

0.001

0.01

0.05

0.2 0.5 1

2 3 45

5

4.98

5

5.02

VIN=2.0V

VIN=3.3V

VIN=3.6V

VIN=4.2V

VIN = 2.0V, 3.3V, 3.6V, 4.2V; VOUT = 5V

Figure 5-4. Load Regulation in Forced PWM

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TPSM81033

SLVSHL0B – JUNE 2024 – REVISED JULY 2024

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