LAN8804 datasheet(66/91 Pages) MICROCHIP

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LAN8804

DS00003591G-page 66

6.4

Package Thermal Specifications

6.5

DC Specifications

Note 6-6

XI can optionally be driven from a 25 MHz single-ended clock oscillator to which these specifications

apply.

Note 6-7

The maximum input frequency for LVDS1/LVDS2 pins is 150 MHz.

TABLE 6-7:

PACKAGE THERMAL PARAMETERS

Parameter

Symbol

Value

Units

Description

Thermal Resistance Junction to Ambient

JA

16.72

°C/W

Measured in still air

13.67

°C/W

Airflow 1 m/s

12.76

°C/W

Airflow 2.5 m/s

Thermal Resistance Junction to Bottom of Case

JT

0.11

°C/W

Measured in still air

Thermal Resistance Junction to Top of Case

JC

2.44

°C/W

—

Thermal Resistance Junction to Board

JB

5.36

°C/W

Thermal Parameter Junction to Board

JB

5.45

°C/W

Measured in still air

Note:

Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESD51.

TABLE 6-8:

NON-VARIABLE I/O DC ELECTRICAL CHARACTERISTICS

Parameter

Symbol

Min

Typ

Max

Units

Notes

ICLK Type Input Buffer

Low Input Level

High Input Level

Input Leakage

VIL

VIH

IIH

—

2.0

-10

—

0.5

—

µA

Note 6-6

LVDS1 Type Input Buffer

Input Common mode

Voltage Range

Input Peak Diff. Voltage

VCM

VID

VID/2

100

—

2.4-VID/2

600

Note 6-7

LVDS2 Type Input Buffer

Input Common mode

Voltage Range

Input Peak Diff. Voltage

VCM

VID

300

—

1.1

—

Note 6-7

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