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MCP60713 Datasheet(PDF) 4 Page - Microchip Technology

Part # MCP60713
Description  10 MHz Precision Op Amps
PDF  41 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP60713 Datasheet(HTML) 4 Page - Microchip Technology

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MCP60711/1U/3
DS20006870A-page 4
 2024 Microchip Technology Inc. and its subsidiaries
TABLE 1-2:
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = 25°C, VDD = 3.5V, VSS = GND, VCM = 0.1V, VOUT =VDD/2,
VL =VDD/2, RL =5kΩ to VL and CL = 30 pF; see Figure 1-7.
Parameters
Sym.
Min. Typ. Max. Units
Conditions
AC Response
Gain-Bandwidth Product
GBWP
—
10
—
MHz
VOUT =0.1 VP-P, GN >+2
Full Power Bandwidth
FPBW
—
1.1
—
VDD =5V, VCM = 2.5V, VOUT =4.6 VP-P, Gain = -1 V/V
Phase Margin
PM
—
65
—
°
G = +1, VOUT =0.1 VP-P
—45
—
G = +1, VOUT =0.1 VP-P, CL = 100 pF
Step Response
Settling Time
tsettle
—
110
—
ns
G = +1, VCM = 0.5V, +0.1V step and 1% settling
—
110
—
G = +1, VCM =VDD – 0.5V, +0.1V step and 1% settling
Slew Rate
SR
—
4.1
—
V/µs
G = +1, VDD =2.2V
—15
—
G = +1, VDD =5.5V
Output Overdrive
Recovery Time (Note 1)
tODR
—
0.9
—
µs
G = -10, VDD =3.5V, VCM =VDD/2, ±0.5V output overdrive
(VIN = VCM ± 0.225V to VCM), 90% of VOUT change
Noise
Input Noise Voltage
Eni
—3.1
—
µVP-P f = 0.1 Hz to 10 Hz, VCM =0.1V
—
5.9
—
f = 0.1 Hz to 10 Hz, VCM =VDD –0.5V
Input Noise Voltage
Density
eni
—5.4
—
nV/√Hz f = 100 kHz, VCM =0.1V
—
6.1
—
f = 100 kHz, VCM =VDD –0.5V
Input Current Noise
Density
ini
—0.6
—
fA/√Hz f = 1 kHz, VCM =0.1V
—
0.6
—
f = 1 kHz, VCM =VDD –0.5V
Harmonic Distortion – Output Nonlinearity
Total Harmonic Distortion
+Noise
THD+N
—
-115
—
dBc
GN = 1 V/V, f = 1 kHz, VOUT =2VP-P, VDD =5V, VCM =2V
EMI Protection
EMI Rejection Ratio
EMIRR
—
29
—
dB
VIN =0.1 VPK, f = 400 MHz
—50
—
VIN =0.1 VPK, f = 900 MHz
—71
—
VIN =0.1 VPK, f = 1800 MHz
—81
—
VIN =0.1 VPK, f = 2400 MHz
—112
—
VIN =0.1 VPK, f = 6000 MHz
Shutdown
Shutdown VOUT Turn On
Time
tSD_ON
—3.1
—
µs
IO = 0, VL = 0V, SHDN = 3.5V to 0V step, 90% of VOUT
change (Note 2)
Shutdown VOUT Turn Off
Time
tSD_OFF
—0.5
—
µs
IO = 0, VL = 0V, SHDN = 0V to 3.5V step, 90% of VOUT
change (Note 2)
Shutdown Setup Time
tSD_SU
—
0.5
—
µs
Minimum setup time between SHDN events (Note 2)
Note 1: tODR includes some uncertainty due to clock edge timing.
2: The POR must be on for the time tPON_TR before SHDN function is enabled; it is disabled when the POR is off.



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