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LTC1159CS Datasheet(PDF) 9 Page - Linear Technology |
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LTC1159CS Datasheet(HTML) 9 Page - Linear Technology |
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9 / 20 page ![]() 9 LTC1159 LTC1159-3.3/LTC1159-5 inductor ripple current and consequent output voltage ripple which can cause Burst Mode operation to be falsely triggered in the LTC1159. Do not allow the core to saturate! Molypermalloy (from Magnetics, Inc.) is a low loss core material for toroids, but it is more expensive than ferrite. A reasonable compromise from the same manufacturer is Kool M µ. Toroids are very space efficient, especially when you can use several layers of wire. Because they generally lack a bobbin, mounting is more difficult. However, new surface mount designs available from Coiltronics do not increase the height significantly. Power MOSFET Selection Two external power MOSFETs must be selected for use with the LTC1159: a P-channel MOSFET for the main switch and an N-channel MOSFET for the synchronous switch. The peak-to-peak drive levels are set by the VCC voltage on the LTC1159. This voltage is typically 4.5V during start-up and 5V to 7V during normal operation (see EXTVCC Pin Connection). Consequently, logic-level threshold MOSFETs must be used in most LTC1159 family applica- tions. The only exception is applications in which EXTVCC is powered from an external supply greater than 8V, in which standard threshold MOSFETs (VGS(TH) < 4V) may be used. Pay close attention to the BVDSS specification for the MOSFETs as well; many of the logic-level MOSFETs are limited to 30V. Selection criteria for the power MOSFETs include the “ON” resistance RDS(ON), reverse transfer capacitance CRSS, input voltage and maximum output current. When the LTC1159 is operating in continuous mode, the duty cycle for the P-channel MOSFET is given by: P-Ch Duty Cycle = VOUT VIN N-Ch Duty Cycle = VIN – VOUT VIN The MOSFET dissipations at maximum output current are given by: N-Ch PD = VIN – VOUT VIN (IMAX)2 (1 + ∂N) RDS(ON) P-Ch PD = VOUT VIN (IMAX)2 (1 + ∂P) RDS(ON) + k(VIN)2 (IMAX) (CRSS) (f) where ∂ is the temperature dependency of RDS(ON) and k is a constant inversely related to the gate drive current. Both MOSFETs have I2R losses while the P-channel equation includes an additional term for transition losses, which are highest at high input voltages. For VIN < 20V the high current efficiency generally improves with larger MOSFETs, while for VIN > 20V the transition losses rapidly increase to the point that the use of a higher RDS(ON) device with lower CRSS actually provides higher effi- ciency. The N-channel MOSFET losses are the greatest at high input voltage or during a short circuit when the N-channel duty cycle is nearly 100%. The term (1 + ∂)isgenerallygivenforaMOSFETintheform of a normalized RDS(ON) vs Temperature curve, but ∂ = 0.007/°C can be used as an approximation for low voltage MOSFETs. CRSS is usually specified in the MOSFET electrical characteristics. The constant k = 5 can be used for the LTC1159 to estimate the relative contributions of the two terms in the P-channel dissipation equation. The Schottky diode D1 shown in Figure 1 only conducts during the dead time between the conduction of the two power MOSFETs. D1 prevents the body diode of the N-channel MOSFET from turning on and storing charge during the dead time, which could cost as much as 1% in efficiency (although there are no other harmful effects if D1 is omitted). Therefore, D1 should be selected for a forward voltage of less than 0.6V when conducting IMAX. APPLICATIO S I FOR ATIO |
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