Absolute Maximum Ratings

Voltage Range on Any Pin Relative to GND ........... -0.5V to 4.0V

Maximum Current into Any Pin............................ -20mA to 20mA

Operating Temperature Range ............................ -40°C to +85°C

Junction Temperature ...................................................... +150°C

Storage Temperature Range ..............................-40°C to +125°C

Lead Temperature (soldering, 10s)...................................+300°C

Soldering Temperature (reflow) ........................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Package Information

8 TDFN-EP

Package Code

T822+3C

Outline Number

21-0168

Land Pattern Number

90-0065

Thermal Resistance, Single-Layer Board:

Junction to Ambient (θJA)

—

Junction to Case (θJC)

—

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θJA)

85.1°C/W

Junction to Case (θJC)

20.8°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates

RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal

considerations, refer to www.maximintegrated.com/thermal-tutorial.

Electrical Characteristics

(Limits are 100% tested at TA = +25ºC and TA = +85ºC. Limits over the operating temperature range and relevant supply voltage

range are guaranteed by design and characterization. Specifications marked GBD are guaranteed by design and not production tested.

Specifications to the minimum operating temperature are guaranteed by design and are not production tested.)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

(Note 1)

1.62

3.3

3.63

V

Supply Current

ICC

Standby

3.5

12

μA

Communicating (Note 2)

60

I2C SCL AND SDA PINS (Note 3)

Low-Level Input Voltage

VIL

-0.3

0.3 ×

VCC

V

High-Level Input Voltage

VIH

VCC > 1.98V

0.7 ×

VCC

VCC +

0.3

V

VCC ≤ 1.98V

0.8 ×

VCC

VCC +

0.3

Hysteresis of Schmitt

Trigger Inputs

VHYS

(Note 4)

0.05 ×

VCC

V

Low-Level Output

Voltage at 4mA Sink

Current

VOL

(Note 5)

0.4

V

DS28C16

I2C Low-Voltage SHA-3 Authenticator

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