TDA8003TSSLASHC2 datasheet(16/24 Pages) PHILIPS

16 / 24 page

2000 Apr 20

Philips Semiconductors

Product speciﬁcation

I2C-bus SIM card interface

TDA8003TS

Pin VCC

output voltage

inactive mode; IO =1mA

−−

0.4

active mode; 5 V card; no load

4.85

5.10

5.40

active mode; 3 V card; no load

2.8

3.05

3.22

active mode; with 200 nF capacitor;

including static load (up to 20 mA)

and dynamic current pulses;

Imax = 200 mA, fmax = 5 MHz;

duration <400 ns

5 V card; 40 nAs pulses

4.60

−

5.40

3 V card; 24 nAs pulses

2.75

−

3.22

output current

inactive mode; pin VCC short circuit

to ground

−−

−1mA

VCC =5or3V; VDD = 2.5 V

−−

VCC =5or3V; VDD = 5.5 V

−−

I

CC

output current

VCC short circuit to ground

−−

120

slew rate on VCC (rise and fall) CL(max) = 300 nF

0.05

0.17

0.25

µs

Pin I/O

output voltage

inactive mode; IO =1mA

−−

0.4

output current

inactive mode; pin I/O short circuit

to ground

−−

−1mA

VOL

LOW-level output voltage

IOL =1mA

−0.2

−

+0.4

VOH

HIGH-level output voltage

+25 < IOH < −25 µA

0.8VCC

−

VCC + 0.2 V

VIL

LOW-level input voltage

−0.3

−

+0.8

VIH

HIGH-level input voltage

1.5

−

VCC + 0.3 V

ILIH

HIGH-level input leakage

current

−−

µA

IIL

LOW-level input current

−−

−600

µA

tt(DI)

data input transition time

CL =30pF

−−

µs

tt(DO)

data output transition time

CL =30pF

−−

0.5

µs

delay time on falling edge

−−

500

Rpu(int)

internal pull-up resistance

between pins I/O and VCC

C1 version

−

Ω

C2 version

−

Ω

Pin SIMI/O

VOL

LOW-level output voltage

IOL =1mA

−0.2

−

+0.3

VOH

HIGH-level output voltage

with internal 20 k

Ω pull-up resistor

to VDDI; IO =10 µA

VDDI − 0.3 −

VDDI + 0.2 V

VIL

LOW-level input voltage

−0.3

−

+0.3VDDI

VIH

HIGH-level input voltage

0.7VDDI

−

VDDI + 0.3 V

ILIH

HIGH-level input leakage

current

−−

µA

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

TDA8003TS/C2 Datasheet(PDF) 16 Page - NXP Semiconductors

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