TDA8003TSSLASHC2 datasheet(3/24 Pages) PHILIPS

3 / 24 page

2000 Apr 20

Philips Semiconductors

Product speciﬁcation

I2C-bus SIM card interface

TDA8003TS

QUICK REFERENCE DATA

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

VDD

supply voltage on pins VDDS

and VDDP

2.5

−

IDD

supply current on pins VDDS

and VDDP

Off mode; VDD =3V

−−

µA

Power-down mode; VDD =3V;

VCC =5V; ICC = 100 µA; SIMCLK

connected to PGND or VDDI;

CLK is stopped

−−

500

µA

active mode; VDD =3V; VCC =3V;

ICC = 6 mA; fCLK = 3.25 MHz

−−

active mode; VDD = 3 V; VCC =5V;

ICC = 10 mA; fCLK = 3.25 MHz

−−

active mode; VDD = 5 V; VCC =3V;

ICC = 6 mA; fCLK = 3.25 MHz

−−

active mode; VDD = 5 V; VCC =5V;

ICC = 10 mA; fCLK = 3.25 MHz

−−

VDDI

interface signal supply voltage

1.5

−

VCC

card supply voltage

5 V card; active mode;

0<ICC < 15 mA; 40 nAs dynamic

load on 200 nF capacitor

4.6

5.4

3 V card; active mode;

0<ICC < 10 mA; 24 nAs dynamic

load on 200 nF capacitor

2.75

3.25

5 V card; bit PDOWN = 1; ICC < 5 mA 4.6

−

5.4

3 V card; bit PDOWN = 1; ICC < 5 mA 2.75

−

3.25

slew rate on VCC (rise and fall)

CL(max) = 200 nF

0.05

−

0.25

µs

tde

deactivation time

−−

120

µs

tact

activation time

−−

150

µs

fi(SIMCLK)

clock input frequency

−

MHz

Tamb

operating ambient temperature

−40

−

+85

°C

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