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TDA8927TH Datasheet(PDF) 30 Page - NXP Semiconductors |
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TDA8927TH Datasheet(HTML) 30 Page - NXP Semiconductors |
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30 / 36 page ![]() 2001 Dec 11 30 Philips Semiconductors Objective specification Power stage 2 × 80 W class-D audio amplifier TDA8927 16 PACKAGE OUTLINES REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT243-1 0 5 10 mm scale D L E A c A2 L 3 Q w M b p 1 d D Z e e x h 117 j Eh non-concave 97-12-16 99-12-17 DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 view B: mounting base side m 2 e v M B UNIT A e 1 A2 bp cD(1) E(1) Z (1) de Dh LL3 m mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 v 0.8 12.2 11.8 1.27 e 2 5.08 2.4 1.6 Eh 6 2.00 1.45 2.1 1.8 3.4 3.1 4.3 12.4 11.0 Q j 0.4 w 0.03 x |
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