ADPA9007 datasheet(6/28 Pages) AD

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Data Sheet

ADPA9007

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 6 of 28

Table 6. Absolute Maximum Ratings

Parameter

Rating

VDD

16.0 V

VGG1

−2.0 V to 0 V

RF Input Power (RFIN)

29 dBm

Continuous Power Dissipation (PDISS), TCASE = 85°C

(Derate 135 mW/°C above 85°C)

12.2 W

Temperature

Maximum Channel

175°C

Quiescent Channel (TCASE = 85°C, VDD = 15 V), IDQ

= 500 mA, and Input Power (PIN) = Off

140.5°C

Storage Range

−65°C to +150°C

Operating Range

−40°C to +85°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction-to-case thermal resistance (channel to exposed

metal ground pad on the underside of the device).

Table 7. Thermal Resistance

Package Type

θJC 1

Unit

CG-32-2

7.4

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to thermal conduction from the channel through the

ground pad to the PCB. The ground pad is held constant at 85°C operating

temperature.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD-protected area only.

Human Body Model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADPA9007

Table 8. ADPA9007, 32-Lead LFCSP_CAV

ESD Model

Withstand Threshold (V)

Class

HBM

±250

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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