RT1050 datasheet(21/115 Pages) NXP

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Electrical characteristics

i.MX RT1050 Crossover Processors Data Sheet for Industrial Products, Rev. 2, 03/2021

NXP Semiconductors

4.1.2.2

12 x 12 MM thermal resistance

Table 9 shows the 12 x 12 MM package thermal resistance data.

4.1.3

Operating ranges

Table 10 provides the operating ranges of the i.MX RT1050 processors. For details on the chip's power

structure, see the “Power Management Unit (PMU)” chapter of the i.MX RT1050 Reference Manual

(IMXRT1050RM).

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

7 Thermal resistance between the die and the central solder balls on the bottom of the package based on simulation.

Table 9. 12 x 12 MM thermal resistance data

Rating

Board type1

1 Thermal test board meets JEDEC specification for this package (JESD51-9).

Symbol

Value

Unit

Junction to Ambient

Thermal resistance2

2 Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is

solely for a thermal performance comparison of one package to another in a standardized specified environment. It is not

meant to predict the performance of a package in an application-specific environment.

JESD51-9, 2S2P

RJA

39.1

oC/W

Junction to Package Top

Thermal resistance2

JESD51-9, 2S2P

JT

0.5

oC/W

Junction to Case Thermal Resistance3

3 Junction-to-Case thermal resistance determined using an isothermal cold plate. Case temperature refers to the mold surface

temperature at eh package top side dead Centre.

JESD51-9, 2S2P

RJC

16.2

oC/W

Junction to Board Thermal Resistance4

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

JESD51-8, 2S2P

RJB

23.04

oC/W

Table 10. Operating ranges

Parameter

Description

Symbol

Operating

Conditions

Min

Typ

Max1 Unit

Comment

Run Mode

VDD_SOC_IN

M7 core at 528

MHz

1.15

—

1.26

—

M7 core at 132

MHz

1.15

—

1.26

M7 core at 24

MHz

0.925

—

1.26

IDLE Mode

VDD_SOC_IN

M7 core

operation at 528

MHz or below

1.15

—

1.26

—

SUSPEND (DSM)

Mode

VDD_SOC_IN

—

0.925

—

1.26

Refer to Table 13 Low power mode

current and power consumption

SNVS Mode

VDD_SOC_IN

—

1.26

—

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