 2002-2023 Microchip Technology Inc. and its subsidiaries

DS20001373D-page 11

TC1262

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-034-AB Rev C Sheet 2 of 2

3-Lead Transistor Outline Package (AB) - [TO-220]

e

N

2.54 BSC

3

Units

Dimension Limits

MILLIMETERS

MIN

NOM

MAX

Mounting Hole Diameter

Terminal Shoulder Length

Terminal Length

Tab Length

Body Width

Exposed Pad Width

Exposed Pad Width

Overall Width

Exposed Pad Length

Molded Package Length

Overall Length

Terminal Thickness

Shoulder Width

Terminal Width

Base to Lead

Tab Thickness

Overall Height

Terminal Pitch

Number of Terminals

A

A1

A2

b

b2

c

D

D1

D2

E

U

E1

E2

H1

L

L1

P

Q

4.064

1.143

2.032

0.635

1.143

0.305

13.730

8.850

9.652

6.858

9.779

5.842

12.700

3.050

3.708

2.540

4.445

1.270

2.540

0.826

1.334

0.432

14.730

9.000

12.6 REF

10.160

6.35 REF

7.874

10.224

6.350

13.716

3.455

3.835

2.794

4.826

1.397

3.048

1.016

1.524

0.559

15.730

9.150

10.668

8.890

10.668

6.858

14.732

3.860

3.962

3.048

Mounting Hole Center