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SN74AC596 Datasheet(PDF) 18 Page - Texas Instruments

Part # SN74AC596
Description  SN74AC596 Triple Ultra-Configurable Multiple-Function Gates With 3-State Outputs And Schmitt-Trigger Inputs
PDF  28 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74AC596 Datasheet(HTML) 18 Page - Texas Instruments

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8.2.2 Detailed Design Procedure
1. Add a decoupling capacitor from VCC to GND. The capacitor needs to be placed physically close to the
device and electrically close to both the VCC and GND pins. An example layout is shown in the Layout
section.
2. Ensure the capacitive load at the output is ≤ 50pF. This is not a hard limit; by design, however, it will optimize
performance. This can be accomplished by providing short, appropriately sized traces from the SN74AC596
to one or more of the receiving devices.
3. Ensure the resistive load at the output is larger than (VCC / IO(max))Ω. Doing this will prevent the maximum
output current from the Absolute Maximum Ratings from being violated. Most CMOS inputs have a resistive
load measured in MΩ; much larger than the minimum calculated previously.
4. Thermal issues are rarely a concern for logic gates; the power consumption and thermal increase, however,
can be calculated using the steps provided in the application report, CMOS Power Consumption and Cpd
Calculation.
8.2.3 Application Curves
GPO
EN
VCC
V
O
Figure 8-2. Typical Application Timing Diagram
8.3 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating listed in the
Recommended Operating Conditions.
Each VCC terminal should have a good bypass capacitor to prevent power disturbance. For the SN74AC596, a
0.1μF bypass capacitor is recommended. To reject different frequencies of noise, use multiple bypass capacitors
in parallel. Capacitors with values of 0.1μF and 1μF are commonly used in parallel.
8.4 Layout
8.4.1 Layout Guidelines
• Bypass capacitor placement
– Place near the positive supply terminal of the device
– Provide an electrically short ground return path
– Use wide traces to minimize impedance
– Keep the device, capacitors, and traces on the same side of the board whenever possible
• Signal trace geometry
– 8mil to 12mil trace width
– Lengths less than 12cm to minimize transmission line effects
– Avoid 90° corners for signal traces
– Use an unbroken ground plane below signal traces
– Flood fill areas around signal traces with ground
– For traces longer than 12cm
• Use impedance controlled traces
• Source-terminate using a series damping resistor near the output
• Avoid branches; buffer signals that must branch separately
SN74AC3G99
SCASE46 – NOVEMBER 2024
www.ti.com
18
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Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: SN74AC3G99



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