INA849 datasheet(3/40 Pages) TI

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5 Pin Configuration and Functions

DA_IN–

IN+

OUT

IN–

REF

DA_IN+

Not to scale

Thermal Pad

Figure 5-1. RGT Package, 16-Pin VQFN (Top View)

Table 5-1. Pin Functions

TYPE

DESCRIPTION

NAME

NO.

Input

Gain option pin 0

Input

Gain option pin 1

Input

Gain option pin 2

DA_IN+

Input

Connection to output difference amplifier summing node

DA_IN–

Input

Connection to output difference amplifier summing node

DGND

Power

Ground reference for digital-logic and gain-setting pins

IN–

Input

Negative (inverting) input

IN+

Input

Positive (noninverting) input

LVDD

Power

Output-driver positive supply

LVSS

Power

Output-driver negative supply

—

Do not connect

—

Do not connect

OUT

Output

REF

Input

Reference input. This pin must be driven by a low-impedance source

VS+

Power

Input-stage positive supply

VS–

Power

Input-stage negative supply

Thermal Pad

Thermal pad

—

The thermal pad must be soldered to the printed-circuit board (PCB). Connect thermal pad

to a plane or large copper pour that is either floating or electrically connected to VS–, even

for applications that have low power dissipation.

www.ti.com

PGA849

SBOSAG3A – MARCH 2024 – REVISED DECEMBER 2024

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