GL422/GL423 USB 2.0 +SD/MMC-controller Combo Solution

©2000-2006 Genesys Logic Inc. - All rights reserved.

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35

PAD_HDATA6

B

MMC mode: HDATA6 from/to

HOST.

(Double Bonding)

36

PAD_UDATA7

B

MMC mode: HDATA7 from/to USB

reader.

(Double Bonding)

NC

G5

37

PAD_HDATA7

B

MMC mode: HDATA7 from/to

HOST.

(Double Bonding)

4.6.4 Flash Interface

The flash interface is used to access AND/NAND flash, defined as Table 4.4. It is also shared with USB test

interface, refers to Table 4.7.

Table 4.4 – Flash Interface

QFN56

Pin#

VFBGA

54

Pin#

Pin Name

Pad#

Pad Name

Type

Description

31

C4

CE0_

65

PAD_CE0_B

B

‘0’ for FLASH chip 0 to select active

(low-active).

32

B4

CE1_

66

PAD_CE1_B

B

‘0’ for FLASH chip 1 to select active

(low-active).

33

A5

CLE

67

PAD_CLE

B

FLASH command latch enable

34

F3

ALE

68

PAD_ALE

B

FLASH address latch enable

30

B5

RE_

64

PAD_RE_B

B

FLASH read enable (low active)

35

A4

WE_

69

PAD_WE_B

B

FLASH write enable (low active)

29

C5

BUSY_

63

PAD_BUSY_B

B

FLASH ready when high, busy when

low.

NC

B3

WP_

71

PAD_WP_B

B

FLASH write protect (low active)

19

G4

DA0

44

PAD_DA0

B

FLASH bus bit0

20

F4

DA1

45

PAD_DA1

B

FLASH bus bit1

21

D6

DA2

46

PAD_DA2

B

FLASH bus bit2

22

E5

DA3

47

PAD_DA3

B

FLASH bus bit3