SLFS022 – D1669, SEPTEMBER 1973—REVISED FEBRUARY 1992

NE555Y

PRECISION TIMERS

POST OFFICE BOX 655303

3

chip information

These chips, properly assembled, display characteristics similar to the NE555 (see electrical table for NE555Y).

Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be

mounted with conductive epoxy or a gold-silicon preform.

GND

RESET

(4)

CONT

VCC

(8)

1

THRES

TRIG

R

R

R

DISCH

OUT

S

R

R1

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJ max = 150° C

TOLERANCES ARE

± 10%

ALL DIMENSIONS ARE IN MILS

PIN (1) INTERNALLY CONNECTED

TO BACKSIDE OF CHIP

(5)

(6)

(2)

(1)

(7)

(3)

BONDING PAD ASSIGNMENTS

41

42

(1)

(2)

(3)

(4)

(8)

(7)

(6)

(5)