5 Specifications

5.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage range

at terminals (2)

VIN, VOUT, SW1, SW2

–0.3

27

V

BOOT1

SW1–0.3

SW1+6

V

BOOT2

SW2–0.3

SW2+6

V

EN/UVLO, VCC, SCL, SDA, COMP, FB/INT, MODE

–0.3

6

V

EN/UVLO, SCL, SDA, COMP, FB/INT, MODE

–0.3

VCC+0.3

V

TJ

Operating Junction, TJ (3)

–40

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

All voltage values are with respect to network ground terminal.

(3)

High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.

5.2 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage range (Vout ≥ 3.0V)

2.4

22

V

Input voltage range (Vout < 3.0V)

3

22

V

VOUT

Output voltage range

0.8

22

V

L

Effective inductance range

1

4.7

10

µH

CIN

Effective input capacitance range

4.7

22

µF

COUT

Effective output capacitance range

10

100

1000

µF

TJ

Operating junction temperature

–40

125

°C

5.3 Thermal Information

THERMAL METRIC(1)

VAL (WQFN)

VAL (WQFN)

UNIT

15 PINS

15 PINS

Standard

EVM (2)

RθJA

Junction-to-ambient thermal resistance

47.6

33

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

N/A

N/A

°C/W

RθJB

Junction-to-board thermal resistance

N/A

N/A

°C/W

ΨJT

Junction-to-top characterization parameter

0.6

0.7

°C/W

YJB

Junction-to-board characterization parameter

6.6

11.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Measured on TPS55285EVM, 4-layer, 2oz/1oz/1oz/2oz copper PCB.

5.4 Electrical Characteristics

TJ = -40°C to 125°C, VIN = 12V and VOUT = 20V. Typical values are at TJ = 25°C, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

POWER SUPPLY

VIN

Input voltage range

2.4

22

V

TPS55285

SLVSI72 – FEBRUARY 2025

www.ti.com

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