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EMIF09-SD01F3 Datasheet(PDF) 6 Page - STMicroelectronics |
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EMIF09-SD01F3 Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 8 page ![]() 3 Package information EMIF09-SD01F3 6/8 3 Package information Figure 10. Mechanical data Figure 13. Flip-chip tape and reel specifications Figure 11. Foot print recommendations Figure 12. Marking 605 µm ± 55 1.97 mm ± 30 µm 255 µm± 40 400 µm ± 40 220 µm recommended 220 µm recommended 260 µm maximum Solder stencil opening : Copper pad Diameter: Solder mask opening: 300 µm minimum x y x w z w E Dot, ST logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location Dot identifying Pin A1 location User direction of unreeling All dimensions in mm 4 +/- 0.1 4 +/- 0.1 Ø 1.5 +/- 0.1 0.69 +/- 0.05 2.11 |
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