EMIF09-SD01F3 datasheet(5/8 Pages) STMICROELECTRONICS

5 / 8 page

EMIF09-SD01F3

2 Ordering information scheme

5/8

Figure 8.

Aplac model

Figure 9.

Aplac model variables

Ordering information scheme

MODEL = D2

Rline

MODEL = D3

Rsub

Rbump

Lbump

MODEL = D1

MODEL = D4

data0

sddata0

Lbump

Rbump

Rgnd

Rbump

Lbump

Lbump Rbump

Lgnd

Rgnd

Lgnd

Rbump

Lbump

Rgnd

Lgnd

Variables

aplacvar Rline 40

aplacvar C_d1 14.5p

aplacvar C_d2 6.5p

aplacvar C_d3 303p

aplacvar C_d4 14.5p

aplacvar Lbump 43pH

aplacvar Rbump 17m

aplacvar Cbump 150f

aplacvar Lgnd 150pH

aplacvar Rgnd 10m

aplacvar Rsub 5

Diode D1

BV=7

IBV=1m

CJO=C_d1

M=0.28

RS=1.13

VJ=0.6

TT=100n

Diode D2

BV=7

IBV=1m

CJO=C_d2

M=0.28

RS=0.8

VJ=0.6

TT=100n

Diode D3

BV=7

IBV=1m

CJO=C_d3

M=0.28

RS=0.37

VJ=0.6

TT=100n

Diode D4

BV=7

IBV=1m

CJO=C_d4

M=0.28

RS=1.13

VJ=0.6

TT=100n

EMIF

xx zz

EMI Filter

Number of lines

Information

Package

x = resistance value (Ohms)

z = capacitance value / 10(pF)

2 letters = application

2 digits = version

F = Flip-Chip

3 = Lead free Pitch = 400µm, Bump = 260µm

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