EMIF09-SD01F3

4 Ordering information

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In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:

www.st.com.

4

Ordering information

Note:

More information is available in the application note :

AN1235 :"Flip Chip : Package description and recommendations for use"

AN1751 : EMI Filters: Recommendations and measurements

5

Revision history

Part Number

Marking

Package

Weight

Base qty

Delivery mode

EMIF09-SD01F3

GZ

Flip-Chip

5.2 mg

5000

Tape and reel (7”)

Date

Revision

Changes

19-Oct-2005

1

Initial release.

09-Feb-2006

2

Tape cavity dimensions added in Figure 13. Other graphics improved.