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BGA2803 Datasheet(PDF) 13 Page - NXP Semiconductors |
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BGA2803 Datasheet(HTML) 13 Page - NXP Semiconductors |
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13 / 18 page ![]() BGA2803 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 5 — 13 July 2015 13 of 18 NXP Semiconductors BGA2803 MMIC wideband amplifier 9. Test information [1] For decoupling a decoupling capacitor (Cdec) is used on one of the positions of P5 to P24. The results mentioned in this data sheet have been obtained using the decoupling capacitor Cdec on position P22. For decoupling a decoupling capacitor (Cdec) is used on one of the positions of P5 to P24. The results mentioned in this data sheet have been obtained using the decoupling capacitor Cdec on position P22. The distance between the center of pin 1 and the center of position P22 is 7.43 mm. Fig 12. PCB layout and demo board with components Table 15. List of components used for the typical application Component Description Value Dimensions Remarks C1, C2 multilayer ceramic chip capacitor 470 pF 0603 X7R RF coupling capacitor P5 to P24 [1] position for multilayer ceramic chip capacitor Cdec 470 pF 0603 X7R RF decoupling capacitor IC1 BGA2803 MMIC - SOT363 |
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