TX

B2

A2

B1

A1

RX

GND

V+

3

TMP104

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SBOS564B – NOVEMBER 2011 – REVISED DECEMBER 2018

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5 Pin Configuration and Functions

YFF PACKAGE

WCSP-4 (DSBGA-4)

(TOP VIEW)

Pin Functions

PIN

DESCRIPTION

NO.

NAME

A1

V+

Supply voltage

A2

GND

Ground

B1

TX

Serial data output pin (push-pull output)

B2

RX

Serial data input pin

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Supply voltage

4

V

Input voltage

–0.3

(V+) + 0.5

and

≤ 4

V

Operating temperature

–55

150

°C

Junction temperature

+150

°C

Storage temperature, Tstg

–60

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±100

Machine model (MM)

200

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

6.3 Thermal Information

THERMAL METRIC(1)

TMP104

UNIT

YFF (DSBGA)

4 PINS

RθJA

Junction-to-ambient thermal resistance

188.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

2.1

°C/W

RθJB

Junction-to-board thermal resistance

35.1

°C/W

ψJT

Junction-to-top characterization parameter

10.6

°C/W

ψJB

Junction-to-board characterization parameter

35.1

°C/W