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ADC14155HCVAL Datasheet(PDF) 2 Page - Texas Instruments

Part # ADC14155HCVAL
Description  ADC14155QML-SP, radiation hardened, 14-Bit, 155-MSPS, 1.1-GHz bandwidth A/D
PDF  36 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

ADC14155HCVAL Datasheet(HTML) 2 Page - Texas Instruments

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ADC14155QML-SP
SNAS378L – NOVEMBER 2008 – REVISED FEBRUARY 2019
www.ti.com
Product Folder Links: ADC14155QML-SP
Submit Documentation Feedback
Copyright © 2008–2019, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 6
6.1
Absolute Maximum Ratings ...................................... 6
6.2
ESD Ratings.............................................................. 6
6.3
Recommended Operating Conditions ....................... 6
6.4
Thermal Information .................................................. 6
6.5
ADC14155 Converter Electrical Characteristics DC
Parameters................................................................. 7
6.6
ADC14155 Converter Electrical Characteristics
(Continued) DYNAMIC Parameters(1) ....................... 8
6.7
ADC14155 Converter Electrical Characteristics
(Continued) Logic and Power Supply Electrical
Characteristics(1)...................................................... 10
6.8
ADC14155 Converter Electrical Characteristics
(Continued) Timing and AC Characteristics(1)......... 11
6.9
Timing Diagram....................................................... 12
6.10
Transfer Characteristic.......................................... 12
6.11
Typical Performance Characteristics, DNL, INL ... 14
6.12
Typical Performance Characteristics, Dynamic
Performance............................................................. 15
7
Detailed Description ............................................ 18
7.1
Overview ................................................................. 18
7.2
Functional Block Diagram ....................................... 18
7.3
Feature Description................................................. 18
7.4
Device Functional Modes........................................ 22
8
Application and Implementation ........................ 23
8.1
Application Information............................................ 23
8.2
Typical Application .................................................. 24
8.3
Radiation Environments .......................................... 25
9
Power Supply Recommendations ...................... 26
10
Layout................................................................... 27
10.1
Layout Guidelines ................................................. 27
10.2
Layout Example .................................................... 28
11
Device and Documentation Support ................. 29
11.1
Device Support .................................................... 29
11.2
Receiving Notification of Documentation Updates 30
11.3
Community Resources.......................................... 30
11.4
Trademarks ........................................................... 30
11.5
Electrostatic Discharge Caution ............................ 30
11.6
Glossary ................................................................ 31
12
Mechanical, Packaging, and Orderable
Information ........................................................... 31
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision K (September 2018) to Revision L
Page
•
Added Figure 20 .................................................................................................................................................................. 17
Changes from Revision J (March 2018) to Revision K
Page
•
Deleted inconsistent footnotes ............................................................................................................................................... 6
•
Added standardized thermal values ....................................................................................................................................... 6
•
Changed formatting of temperature conditions in the spec tables ......................................................................................... 7
•
Added subgroups to all applicable specs .............................................................................................................................. 7
•
Changed location of 12.1-Ω capacitor on VIN- pin in the circuit diagram of the Typical Application section......................... 24
Changes from Revision I (March 2013) to Revision J
Page
•
Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes section,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
•
Deleted DYNAMIC CONVERTER CHARACTERISTICS, AIN = –1 dBFS duplicate specs.................................................... 9



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