6

ADC14155QML-SP

SNAS378L – NOVEMBER 2008 – REVISED FEBRUARY 2019

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Copyright © 2008–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are measured with respect to GND = AGND = DGND = DRGND = 0 V, unless otherwise specified.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage (VA, VD)

–0.3

4.2

V

Supply voltage (VDR)

–0.3

2.35

V

|VA–VD|

100

mV

Voltage on any input pin (not to exceed 4.2 V)

–0.3

VA + 0.3

V

Voltage on any output pin (not to exceed 2.35 V)

–0.3

VDR + 0.2

V

Input current at any pin other than supply pins

–5

5

mA

Package input current

–50

50

mA

Max junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

(1)

All voltages are measured with respect to GND = AGND = DGND = DRGND = 0 V, unless otherwise specified.

(2)

All GND voltages should be within 100mv of each other.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Operating temperature

–55

125

°C

Supply voltage (VA, VD)

3

3.6

V

Output driver supply (VDR)

1.6

2

V

CLK

–0.05

VA + 0.05

V

Clock duty cycle

30%

70%

Analog input pins

0

2.6

V

VCM

1.4

1.6

V

|AGND-DGND|(2)

100

mV

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC

ADC14155QML

UNIT

NBA (CFP)

48 PINS

RθJA

Junction-to-ambient thermal resistance

27.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

11.7

°C/W

RθJB

Junction-to-board thermal resistance

11.4

°C/W

ψJT

Junction-to-top characterization parameter

4.6

°C/W

ψJB

Junction-to-board characterization parameter

11.1

°C/W

RθJC(bottom)

(1)

Junction-to-case (bottom) thermal resistance

3.0

°C/W