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CC2564C Datasheet(PDF) 2 Page - Texas Instruments |
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CC2564C Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 58 page ![]() PCM-I2S UART CC2564C I/O interface Coprocessor (See Note) BR/EDR main processor Modem arbitrator DRP Power management Clock management 2.4-GHz band-pass filter HCI Slow clock Fast clock Power Shutdown Copyright © 2016, Texas Instruments Incorporated 2 CC2564C SWRS199B – APRIL 2016 – REVISED JUNE 2020 www.ti.com Submit Documentation Feedback Product Folder Links: CC2564C Device Overview Copyright © 2016–2020, Texas Instruments Incorporated (1) For more information on these devices, see Mechanical, Packaging, and Orderable Information. 1.3 Description The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh- generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1- compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation. The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported: Serial port profile (SPP) Advanced audio distribution profile (A2DP) Audio/video remote control profile (AVRCP) Hands-free profile (HFP) Human interface device (HID) Generic attribute profile (GATT) Several Bluetooth low energy profiles and services Device Information(1) PART NUMBER PACKAGE BODY SIZE CC2564CRVM RVM (76) 8.00 mm × 8.00 mm × 0.60 mm 1.4 Functional Block Diagram Note: The following technologies and assisted modes cannot be used simultaneously with the coprocessor: Bluetooth low energy, assisted HFP 1.6 (WBS), and assisted A2DP. Only one technology or assisted mode can be used at a time. |
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