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CC2564C Datasheet(PDF) 12 Page - Texas Instruments |
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CC2564C Datasheet(HTML) 12 Page - Texas Instruments |
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12 / 58 page ![]() 12 CC2564C SWRS199B – APRIL 2016 – REVISED JUNE 2020 www.ti.com Submit Documentation Feedback Product Folder Links: CC2564C Specifications Copyright © 2016–2020, Texas Instruments Incorporated 5.6 Electrical Characteristics RATING CONDITION MIN MAX UNIT High-level output voltage, VOH At 2, 4, 8 mA 0.8 × VDD_IO VDD_IO V At 0.1 mA VDD_IO – 0.2 VDD_IO Low-level output voltage, VOL At 2, 4, 8 mA 0 0.2 × VDD_IO V At 0.1 mA 0 0.2 I/O input impedance Resistance 1 MΩ Capacitance 5 pF Output rise and fall times, 10% to 90% (digital pins) CL = 20 pF 10 ns I/O pull currents PCM–I2S bus, TX_DBG PU Typical = 6.5 3.5 9.7 µA PD Typical = 27 9.5 55 All others PU Typical = 100 50 300 PD Typical = 100 50 360 5.7 Thermal Resistance Characteristics for VQFNP-MR (RVM) Package (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. (2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70ºC is assumed. over operating free-air temperature range (unless otherwise noted) THERMAL METRICS(1) C/W(2) Rθja Junction-to-free-air 34.6 Rθjctop Junction-to-case-top 17.9 Rθjcbottom Junction-to-case-bottom 1.6 Rθjb Junction-to-board 12.0 φjt Junction-to-package-top 0.2 φjb Junction-to-package-bottom 12.0 |
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