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CC2564C Datasheet(PDF) 12 Page - Texas Instruments

Part # CC2564C
Description  CC2564C Dual-Mode Bluetooth® Controller
PDF  58 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

CC2564C Datasheet(HTML) 12 Page - Texas Instruments

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CC2564C
SWRS199B – APRIL 2016 – REVISED JUNE 2020
www.ti.com
Submit Documentation Feedback
Product Folder Links: CC2564C
Specifications
Copyright © 2016–2020, Texas Instruments Incorporated
5.6
Electrical Characteristics
RATING
CONDITION
MIN
MAX
UNIT
High-level output voltage, VOH
At 2, 4, 8 mA
0.8 × VDD_IO
VDD_IO
V
At 0.1 mA
VDD_IO – 0.2
VDD_IO
Low-level output voltage, VOL
At 2, 4, 8 mA
0
0.2 × VDD_IO
V
At 0.1 mA
0
0.2
I/O input impedance
Resistance
1
MΩ
Capacitance
5
pF
Output rise and fall times, 10% to 90% (digital pins)
CL = 20 pF
10
ns
I/O pull
currents
PCM–I2S bus, TX_DBG
PU
Typical = 6.5
3.5
9.7
µA
PD
Typical = 27
9.5
55
All others
PU
Typical = 100
50
300
PD
Typical = 100
50
360
5.7
Thermal Resistance Characteristics for VQFNP-MR (RVM) Package
(1)
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2)
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
•
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
over operating free-air temperature range (unless otherwise noted)
THERMAL METRICS(1)
C/W(2)
Rθja
Junction-to-free-air
34.6
Rθjctop
Junction-to-case-top
17.9
Rθjcbottom
Junction-to-case-bottom
1.6
Rθjb
Junction-to-board
12.0
φjt
Junction-to-package-top
0.2
φjb
Junction-to-package-bottom
12.0



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