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EXAMPLE STENCIL DESIGN

(16.25)

14X (1.27)

16X (2)

16X (0.6)

16X (1.875)

16X (0.6)

14X (1.27)

(16.375)

SOIC - 2.65 mm max height

DWW0016A

PLASTIC SMALL OUTLINE

4221501/A 11/2014

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

8. Board assembly site may have different recommendations for stencil design.

STANDARD

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:4X

SYMM

SYMM

1

8

9

16

PCB CLEARANCE & CREEPAGE OPTIMIZED

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:4X

SYMM

SYMM

1

8

9

16

32

ISO7840, ISO7840F

SLLSEN2B – JULY 2015 – REVISED APRIL 2016

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Product Folder Links: ISO7840 ISO7840F

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