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ISO7840, ISO7840F

SLLSEN2B – JULY 2015 – REVISED APRIL 2016

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

ISO7840

UNIT

THERMAL METRIC(1)

DW (SOIC)

DWW (SOIC)

16 Pins

16 Pins

RθJA

Junction-to-ambient thermal resistance

78.9

78.9

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

41.6

41.1

°C/W

RθJB

Junction-to-board thermal resistance

43.6

49.5

°C/W

ψJT

Junction-to-top characterization parameter

15.5

15.2

°C/W

ψJB

Junction-to-board characterization parameter

43.1

48.8

°C/W

RθJC(bottom) Junction-to-case(bottom) thermal resistance

N/A

N/A

°C/W

6.5 Power Ratings

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, input a 50 MHz 50% duty cycle square wave

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

PD

Maximum power dissipation by ISO7840x

200

mW

PD1

Maximum power dissipation by side-1 of

ISO7840x

40

mW

PD2

Maximum power dissipation by side-2 of

ISO7840x

160

mW