LM20

SNIS106Q – DECEMBER 1999 – REVISED JANUARY 2015

www.ti.com

Thermal Considerations (continued)

Table 5 summarizes the rise in die temperature of the LM20 without any loading and the thermal resistance for

different conditions.

Table 5. Temperature Rise of LM20 Due to Self-Heating and Thermal Resistance (RΘJA)

See more Layout Examples

SC70-5

SC70-5

No Heat Sink

Small Heat Sink

RθJA

TJ − TA

RθJA

TJ − TA

(°C/W)

(°C)

(°C/W)

(°C)

Still air

412

0.2

350

0.19

Moving air

312

0.17

266

0.15

DSBGA

No Heat Sink

RθJA

TJ − TA

(°C/W)

(°C)

Still air

340

0.18

16

Submit Documentation Feedback

Copyright © 1999–2015, Texas Instruments Incorporated

Product Folder Links: LM20