LM20

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SNIS106Q – DECEMBER 1999 – REVISED JANUARY 2015

5 Pin Configuration and Functions

DCK Package

5-Pin SC70

(Top View)

YZR Package

4-Pin DSBGA

(Top View)

Pin Functions

PIN

TYPE

DESCRIPTION

NAME

DSBGA

SC70

Device substrate and die attach paddle, connect to power supply negative

GND

—

2

GND

terminal. For optimum thermal conductivity to the PC board ground plane, pin

2 must be grounded. This pin may also be left floating.

GND

A2

5

GND

Device ground pin, connect to power supply negative terminal.

NC (pin 1) must be left floating or grounded. Other signal traces must not be

NC

A1

1

—

connected to this pin.

Analog

VO

B1

3

Temperature sensor analog output

Output

V+

B2

4

Power

Positive power supply pin

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply Voltage

−0.2

6.5

V

Output Voltage

−0.6

(V+ + 0.6 )

V

Output Current

10

mA

Input Current at any pin(3)

5

mA

Maximum Junction Temperature (TJMAX)

150

°C

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.

(3)

When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V

+), the current at that pin should be limited to 5 mA.

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