4

LM5010

SNVS307G – SEPTEMBER 2004 – REVISED APRIL 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

For detailed information on soldering plastic HTSSOP and WSON packages, see Mechanical, Packaging, and Orderable Information.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

8

75

V

VIN to GND

76

V

BST to GND

90

V

SW to GND (steady state)

–1.5

V

BST to VCC

76

V

BST to SW

14

V

VCC to GND

14

V

SGND to RTN

–0.3

0.3

V

SS to RTN

–0.3

4

V

VIN to SW

76

V

All other inputs to GND

–0.3

7

V

Lead temperature (soldering, 4 s)(2)

260

°C

Junction temperature, TJ

–40

150

°C

Storage temperature, Tstg

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN

Input voltage

8

75

V

IO

Output current

1

A

Ext-VCC

External bias voltage

8

13

V

TJ

Operating junction temperature

–40

125

°C