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TMP411CD Datasheet(PDF) 4 Page - Texas Instruments |
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TMP411CD Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 48 page ![]() 4 TMP411 SBOS383D – DECEMBER 2006 – REVISED DECEMBER 2016 www.ti.com Product Folder Links: TMP411 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings MIN MAX UNIT Input voltage Pins 2, 3, 4 only –0.5 VS + 0.5 V Input voltage Pins 6, 7, 8 only –0.5 7 V Input current 10 mA Power supply, Vs 7 V Operating temperature range –55 127 °C Junction temperature, TJ(max) 150 °C Storage temperature, Tstg –60 130 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1000 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT V+ Supply voltage 2.7 3.3 5.5 V TA Operating free-air temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) TMP411 UNIT D (SOIC) DGK (VSSOP) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 112.3 166.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 59.4 58.3 °C/W RθJB Junction-to-board thermal resistance 53.0 86.7 °C/W ψJT Junction-to-top characterization parameter 13.6 7.5 °C/W ψJB Junction-to-board characterization parameter 52.4 85.2 °C/W |
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