7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage, VDD (2)

6.5

V

All other pins(2)

–0.3

6.5

V

Maximum low output current, IOL

5

mA

Maximum high output current, IOH

–5

mA

Input clamp current, IIK (VI<0 or VI>VDD)

–20

20

mA

Output clamp current, IOK (VO<0 or VO>VDD)

–20

20

mA

Continuous total power dissipation

Operating free-air temperature range, TA

–40

125

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

All voltage values are with respect to GND. For reliable operation the device should not be operated at 6.5 V for more than t = 1000 h

continuously.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

Charged-device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Supply voltage

2

6

V

TA

Operating free-air temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

TPS3809xxx-Q1

UNIT

DBV (SOT-23)

3 PINS

RθJA

Junction-to-ambient thermal resistance

232.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

187.6

°C/W

RθJB

Junction-to-board thermal resistance

104.1

°C/W

ψJT

Junction-to-top characterization parameter

40.5

°C/W

ψJB

Junction-to-board characterization parameter

104.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1

SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020

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