I/O

GND

TO INTERNAL

CIRCUITRY

4

DAC084S085

SNAS363F – MAY 2006 – REVISED MARCH 2016

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Copyright © 2006–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are measured with respect to GND = 0 V, unless otherwise specified.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Semiconductor Sales Office/Distributors for

availability and specifications.

(4)

When the input voltage at any pin exceeds 5.5 V or is less than GND, the current at that pin must be limited to 10 mA. The 20 mA

maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of

10 mA to two.

(5)

The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by

TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula

PDMAX = (TJmax − TA) / θJA. The values for maximum power dissipation is reached only when the device is operated in a severe fault

condition (that is, when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed).

7 Specifications

7.1 Absolute Maximum Ratings

(1) (2) (3)

MIN

MAX

UNIT

Supply voltage, VA

6.5

V

Voltage on any input pin

−0.3

6.5

V

Input current at any pin(4)

10

mA

Package input current(4)

20

mA

Power consumption at TA = 25°C

See(5)

Junction temperature

150

°C

Storage temperature, Tstg

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

Human body model is 100-pF capacitor discharged through a 1.5-k

Ω resistor. Machine model is 220 pF discharged through 0 Ω.

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±2500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(3)

±250

(1)

All voltages are measured with respect to GND = 0 V, unless otherwise specified.

(2)

The inputs are protected as shown below. Input voltage magnitudes up to 5.5 V, regardless of VA, does not cause errors in the

conversion result. For example, if VA is 3 V, the digital input pins can be driven with a 5-V logic device.

7.3 Recommended Operating Conditions

See

(1)

MIN

MAX

UNIT

Operating temperature

−40

105

°C

Supply voltage, VA

2.7

5.5

V

Reference voltage, VREFIN

1

VA

V

Digital input voltage (2)

0

5.5

V

Output load

0

1500

pF

SCLK frequency

40

MHz