LP3905

SNVS374D – JUNE 2006 – REVISED MAY 2013

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Absolute Maximum Ratings

(1) (2)

VIN1,VIN2

−0.2V to 6.0V

(GND

−0.2V) to

FB1, FB2, EN1,EN2

(VIN + 0.2V) to 6.0V (max)

Continuous Power Dissipation(3)

Internally Limited

Junction Temperature (TJ-MAX)

+150°C

Storage Temperature Range

−65°C to +150°C

Maximum Lead Temperature (Soldering, 10 sec.)

260°C

ESD Rating(4)

Human Body Model

2.5kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage.

(4)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. MIL-STD-883 3015.7

Operating Ratings

(1) (2)

VIN1 (Buck1 and 2 Input Voltage),VIN2 (LDO1 and 2 Input Voltage)

(3)

3V to 5.5V

Recommended Load Current (Buck)

0mA to 600 mA

0mA to 100mA with 0.47uF O/P cap

Recommended Load Current (LDO)

0mA to 150mA with 1.0uF O/P cap

Junction Temperature (TJ) Range

−40°C to +125°C

Ambient Temperature (TA) Range

(4)

−40°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

VIN1 and VIN2 should be tied together at all times for proper Power Up

(4)

In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have

to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the

maximum power dissipation of the device in the application (PD-MAX) and the junction to ambient thermal resistance of the package (θJA)

in the application, as given by the following equation:TA-MAX= TJ-MAX− (θJAx PD-MAX).

Thermal Properties

Junction-to-Ambient Thermal Resistance (

θJA) NHL0014B package

(1)

37.3ºC/W

(1)

Junction to ambient thermal resistance is highly dependent on board layout, PCB material environmental conditions and applications. In

applications where high power dissipation exists, special care must be given to thermal dissipation issues in board design. The use of

thermal vias under the pad may be required. For more on these topics, please refer to the Application Note: AN-1187: Leadless

leadframe Package (LLP) SNOA401.

4

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