5

AMC1336

www.ti.com

SBAS951B – AUGUST 2019 – REVISED APRIL 2020

Product Folder Links: AMC1336

Submit Documentation Feedback

Copyright © 2019–2020, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

AMC1336

UNIT

DWV (SOIC)

8 PINS

RθJA

Junction-to-ambient thermal resistance

94

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

36

°C/W

RθJB

Junction-to-board thermal resistance

46.1

°C/W

ψJT

Junction-to-top characterization parameter

11.5

°C/W

ψJB

Junction-to-board characterization parameter

44.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

VALUE

UNIT

PD

Maximum power dissipation (both sides)

AVDD = DVDD = 5.5 V

90.75

mW

AVDD = DVDD = 3.6 V

50.4

PD1

Maximum power dissipation (high-side supply)

AVDD = 5.5 V

57.75

mW

AVDD = 3.6 V

32.4

PD2

Maximum power dissipation (controller-side supply)

DVDD = 5.5 V

33

mW

DVDD = 3.6 V

18