MIC2003 datasheet(15/16 Pages) MICREL

15 / 16 page

Micrel

MIC2003/MIC20013

October 2005

M9999-102605

hbwhelp@micrel.com or (408) 955-1690

Where: TJ = junction temperature,

TA = ambient temperature

Rθ(J-A) is the thermal resistance of the package

In normal operation MIC2003/2013’s Ron is low enough

that no significant I2R heating occurs. Device heating is

most often caused by a short circuit, or very heavy load,

when a significant portion of the input supply voltage

appears across MIC2003/2013’s power MOSFET.

Under these conditions the heat generated will exceed

the package and PCB’s ability to cool the device and

thermal limiting will be invoked.

In Figure 10 die temperature is plotted against IOUT

assuming a constant case temperature of 85°C. The

plots also assume a worst case RON of 140 mΩ at a die

temperature of 135°C. Under these conditions it is clear

that an SOT-23 packaged device will be on the verge of

thermal shutdown, typically 140°C die temperature,

when operating at a load current of 1.25A. For this

reason

recommend

using

MLF

packaged

MIC2003/2013s for any design intending to supply

continuous currents of 1A or more.

Die Temperature vs. Iout for Tcase = 85°C

100

120

140

160

0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00

Iout - Amps

SOT-23

MLF

Figure 10. Die Temperature vs. IOUT

When operating at higher current levels or in higher

temperature

environments

use

Micrel’s

MLF

packaging is recommended. MLF packages provide an

exposed power paddle on the back side to which

electrical and thermal contact can be made with the

device. This significantly reduces the package’s thermal

resistance and thus extends the MIC2005/2013’s

operating range.

2 Vias

0.3 mm diam.

to Ground Plane

0.8 mm

1.4 mm

Figure 11. Pad for thermal mounting to PCB

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