ADS1148IPWR datasheet(8/100 Pages) TI2

8 / 100 page

ADS1146, ADS1147, ADS1148

SBAS453G – JULY 2009 – REVISED AUGUST 2016

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Product Folder Links: ADS1146 ADS1147 ADS1148

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(1)

AINP and AINN denote the positive and negative inputs of the PGA.

(2)

For VREF > 2.7 V, the differential input voltage must not exceed 2.7 V / Gain.

(3)

REFPx and REFNx denote the differential reference input pair (ADS1146, ADS1147), or one of the two available differential reference

input pairs (ADS1148).

(4)

External clock only required if the internal oscillator is not used.

7.3 Recommended Operating Conditions

Over operating ambient temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

POWER SUPPLY

Analog power supply

AVDD to AVSS

2.7

5.25

AVSS to DGND

–2.65

0.1

AVDD to DGND

2.25

5.25

Digital power supply

DVDD to DGND

2.7

5.25

ANALOG INPUTS(1)

VIN

Differential input voltage

V(AINP) – V(AINN)

(2)

–VREF / Gain

VREF / Gain

VCM

Common-mode input voltage

(V(AINP) + V(AINN)) / 2

See Equation 3

VOLTAGE REFERENCE INPUTS(3)

VREF

Differential reference input voltage

V(REFPx) – V(REFNx)

0.5

(AVDD – AVSS) – 1

V(REFNx)

Absolute negative reference voltage

AVSS – 0.1

V(REFPx) – 0.5

V(REFPx)

Absolute positive reference voltage

V(REFNx) + 0.5

AVDD + 0.1

EXTERNAL CLOCK INPUT(4)

fCLK

External clock frequency

4.5

MHz

External clock duty cycle

25%

75%

GENERAL-PURPOSE INPUTS AND OUTPUTS (GPIO)

GPIO input voltage

AVSS

AVDD

DIGITAL INPUTS

Digital input voltage

DGND

DVDD

TEMPERATURE RANGE

Operating ambient temperature

–40

125

°C

Specified ambient temperature

–40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

ADS1146

ADS1147

ADS1148

UNIT

PW (TSSOP)

RHB (VQFN)

16 PINS

20 PINS

28 PINS

32 PINS

RθJA

Junction-to-ambient thermal resistance

95.2

87.4

74.2

32.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

28.9

21.7

20.2

23.9

°C/W

RθJB

Junction-to-board thermal resistance

39.6

31.8

6.6

°C/W

ψJT

Junction-to-top characterization parameter

1.5

0.8

0.3

°C/W

ψJB

Junction-to-board characterization parameter

40.4

38.9

31.3

6.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

1.6

°C/W

ADS1148IPWR Datasheet(PDF) 8 Page - Texas Instruments

ADS1148IPWR Datasheet(HTML) 8 Page - Texas Instruments

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