AMC7891

www.ti.com

SBAS518A

– AUGUST 2011 – REVISED DECEMBER 2011

ORDERING INFORMATION(1)

PACKAGE

TRANSPORT

TA

ORDER CODE

QUANTITY

DRAWING/TYPE(2)(3)

MEDIA

AMC7891SRHHT

250

–40°C to 105°C

RHH / 36-QFN Quad Flatpack No-Lead

Tape and Reel

AMC7891SRHHR

2000

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the

device product folder at www.ti.com.

(2)

Thermal Pad Size: 4.39 mm x 4.39 mm

(3)

MSL Peak Temperature: Level-3-260C-168 HR

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

VALUE

UNIT

MIN

MAX

AVDD to AGND

(2)

–0.3

6

V

GPIOVDD to DGND

–0.3

6

V

Supply voltage range

SPIVDD to DGND

–0.3

6

V

AGND to DGND

–0.3

0.3

V

AIN[0:7], DACOUT[0:3], REF to AGND

–0.3

AVDD + 0.3

V

CS, SCLK, SDI to DGND

–0.3

6

V

Pin voltage range

SDO to DGND

–0.3

SPIVDD + 0.3

V

GPIOA[0:3], GPIOB[0:3], GPIOC[0:3] to DGND

–0.3

GPIOVDD + 0.3

V

DAV to DGND

–0.3

6

V

Operating free-air temperature range, TA: AMC7891

(3) (4)

–40

105

°C

Storage temperature range

–40

150

°C

Human body model (HBM)

2.5

kV

ESD ratings:

Charged device model (CDM)

1.0

kV

(1)

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute

maximum conditions for extended periods may affect device reliability.

(2)

AGND1 and AGND2 must be tied together as AGND.

(3)

Air flow or heat sinking reduces

θJA and may be required for sustained operation at 105°C and maximum operating conditions.

(4)

Soldering the device thermal pad to the board ground plane is strongly recommended.

THERMAL INFORMATION

AMC7891

THERMAL METRIC(1)

RHH PACKAGE

UNITS

36 PINS

θJA

Junction-to-ambient thermal resistance

30.6

θJCtop

Junction-to-case (top) thermal resistance

16.0

θJB

Junction-to-board thermal resistance

5.3

°C/W

ψJT

Junction-to-top characterization parameter

0.2

ψJB

Junction-to-board characterization parameter

5.3

θJCbot

Junction-to-case (bottom) thermal resistance

0.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Copyright

© 2011, Texas Instruments Incorporated

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Product Folder Link(s): AMC7891