Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Description (continued).................................................. 4

6 Pin Configuration and Functions...................................4

7 Specifications.................................................................. 9

7.1 Absolute Maximum Ratings (1) (2) ...............................9

7.2 ESD Ratings............................................................... 9

7.3 Recommended Operating Conditions.........................9

7.4 Thermal Information....................................................9

7.5 Electrical Characteristics...........................................10

7.6 Electrical Characteristics, Device Parameters (1) ..... 11

7.7 Switching Characteristics.......................................... 11

7.8 Timing Diagrams....................................................... 11

8 Detailed Description......................................................13

8.1 Overview................................................................... 13

8.2 Functional Block Diagram......................................... 14

8.3 Feature Description...................................................15

8.4 Device Functional Modes..........................................15

9 Applications and Implementation................................ 16

9.1 Application Information............................................. 16

9.2 Typical Applications.................................................. 16

10 Layout...........................................................................21

10.1 Layout Guidelines................................................... 21

10.2 Layout Example...................................................... 22

11 Device and Documentation Support..........................24

11.1 Community Resources............................................24

11.2 Trademarks............................................................. 24

12 Mechanical, Packaging, and Orderable

Information.................................................................... 24

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (September 2015) to Revision E (December 2020)

Page

• NOTE: The device in the MicroStar Jr. BGA packaging were redesigned using a laminate nFBGA package.

This nFBGA package offers datasheet-equivalent electrical performance. It is also footprint equivalent to the

MicroStar Jr. BGA. The new package designator in place of the discontinued package designator will be

updated throughout the datasheet......................................................................................................................1

• Changed u*jr ZQE to nFBGA ZXH..................................................................................................................... 1

• Changed u*jr ZQE to nFBGA ZXH..................................................................................................................... 4

• Changed u*jr ZQE to nFBGA ZXH..................................................................................................................... 4

• Changed u*jr ZQE to nFBGA ZXH..................................................................................................................... 4

• Changed u*jr ZQE to nFBGA ZXH..................................................................................................................... 7

• Changed u*jr ZQE to nFBGA ZXH. Updated thermal data.................................................................................9

• Changed u*jr ZQE to nFBGA ZXH....................................................................................................................11

• Changed u*jr ZQE to nFBGA ZXH................................................................................................................... 16

Changes from Revision C (August 2015) to Revision D (September 2015)

Page

• Changed Section 3 text string from "....DisplayPort 1.2a..." to "...DisplayPort HBR2..." and from "..HDMI2.0.."

to "...HDMI..." ..................................................................................................................................................... 1

• Deleted RθJC(bot) spec from Thermal Information table as N/A...........................................................................9

• Deleted "Operating free air temperature" spec from Electrical Characteristics table....................................... 10

• Changed Figure 9-5 .........................................................................................................................................20

• Changed Section Power Supply Recommendations text string from "Decoupling capacitors may be used to

reduce noise and improve power supply integrity" to "Decoupling capacitors must be used to reduce power

supply noise"...................................................................................................................................................0

Changes from Revision B (July 2015) to Revision C (July 2015)

Page

• Added ton(OE_L-H), toff(OE_H-L), and tSWITCH_OVER to the Section 7.7 ..................................................................11

Changes from Revision A (May 2014) to Revision B (July 2015)

Page

• Changed the title From: "2.0/DisplayPort 1.2A" To: "DisplayPort"...................................................................... 1

HD3SS215, HD3SS215I

SLAS971E – MAY 2014 – REVISED DECEMBER 2020

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